产品参数

波长

Si detector: 190 to 1150 nm
InGaAs detector: 650 to 1800 nm
Si + InGaAs detectors: 190 to 1800 nm
Si + InGaAs (extended) detectors: 190 to 2300 or 2500 nm

扫描光束直径

Si detector: 5 µm to 4 mm, to 2 µm in Knife-Edge mode*
InGaAs detector: 10 µm to 3 mm, to 2 µm in Knife-Edge mode*
InGaAs (extended) detector: 10 µm to 2 mm, to 2 µm in Knife-Edge mode*

平面间距（4XYmodels）

100 µm: -100, 0, +100, +400 µm
250 µm: -250, 0, +250, +1000 µm
500 µm: -500, 0, +500, +2000 µm
750 µm: -750, 0, +750, +3000 µm

平面间距(3XYKE models)

50 µm: -50, 0, +50, 0 µm
100 µm: -100, 0, +100, 0 µm

束腰直径测量

Second moment (4s) diameter to ISO 11146; Fitted Gaussian & TopHat
1/e² (13.5%) width
User selectable % of peak
Knife-Edge mode* for very small beams

束腰位置测量

在 X、Y 和 Z 方向上 ± 20 µm 最佳

测量源

连续波；脉冲激光，F µm = [500/(PRR in kHz)]

分辨率精度

0.1µm或扫描范围的 0.05%±<2%±= 0.5 µm

M² 测量

1 to > 20, ± 5%

发散/准直，指向

1 mrad最好

最大功率和辐照度

1 W Total & 0.5 mW/µm²

增益范围

1,000:1 Switched 4,096:1 ADC range

显示图形

X-Y-Z Position & Profiles, Zoom x1 to x16

更新率

~5 Hz

平均

用户可选择运行平均值（1 到 8 个样本）

最低电脑要求

Windows, 2 GB RAM, USB 2.0/3.0 port

Beam’R2

BeamMap2

主要特征

集成X和Y轮廓

实时 XYZθΦ 测量和焦点查找

实时指向、发散和M² 测量

接口

USB 2.0 Port-powered

CW or Pulsed?

CW，脉冲最小 PRR（Si 探测器）≈ [500/（激光直径µm）] kHz

波长

Si:190-1150 nm

InGaAs:650-1800 nm

Si+InGaAs:190-1800nm

Si+InGaAs,extended:190-2500nm

X-Y-Z Profiles, plus Θ-Φ

N/A

是

最佳分辨率

0.1 µm

最小光束

2 µm (Knife Edge mode)

更新率

5 Hz real-time (adjustable 2-10 Hz)

M² 测量

Yes - with M2DU-BR accessory

Yes - real-time

定位焦点

Yes - with M2DU-BR accessory

Yes - real-time

指向/发散

Yes - with M2DU-BR accessory

Yes - real-time

开关增益（选项 dB）

32 dB